![[Case Study of Circuit Board Manufacturing] Formation of Heat Dissipation Layer on Metal Materials](https://image.mono.ipros.com/public/product/image/8f2/2000570837/IPROS56661688794056944786.png?w=280&h=280)
[Case Study of Circuit Board Manufacturing] Formation of Heat Dissipation Layer on Metal Materials
With the demand for TIM, we have started the processing of forming heat dissipation layers on metal materials using printing technology!
LED lighting and recent electronic devices such as MPUs have been advancing in high integration and high performance, leading to an increasing tendency for heat generation, making cooling increasingly important. In response, our company has started processing heat dissipation layers on metal materials using printing technology, as the demand for TIM (Thermal Interface Material) to be placed between heat dissipation substrates and heat sinks is rising. While other products enhance thermal conductivity through the properties of the materials themselves, our products are characterized by using printing technology to design the thickness of the heat dissipation layer thinner than that of other TIMs, thereby improving thermal conductivity. [Case Overview] - Thickness of the heat dissipation layer: 40μm to 120μm (theoretically possible to be thicker) - Thermal conductivity: 2.0 W/mK - Capable of forming heat dissipation layers on metals such as aluminum and copper - Heat dissipation sheets are also under development *For more details, please refer to the PDF document or feel free to contact us.
- Company：東洋精密工業
- Price：Other
